PCB Assembly
Beton Technology provides a one-stop
solution for all of your electronics manufacturing service needs, from quick
turnaround prototyping to high volume production. We have the ability to
identify design and production issues during the prototype stage and resolve
them (in consultation with you) before entering series production.
We source all parts directly from the
original manufacturer or authorized distributors (Mouser, Digikey, Avnet,
Future, Verical, Element, RS Components, Arrow Online components, TME,
CoreStaff, Rutronik, TTI) to avoid counterfeit parts.
In PCB factory turnkey PCB assembly
service, we select all components for you according to BOM. If you cannot
purchase specific components, our engineers will provide suitable replacement
suggestions for you to confirm.
| Item | Fabrication Capabilities |
| The assembly number of layers | 1-48 layers |
| Assembly PCB board type | Rigid PCB (FR-4, Metal Core PCB), Flexible PCB (FPC), Rigid-Flex PCB, Aluminum PCB |
| Maximum Assembly PCB Size | 400mm x 1200mm (min 50mm x 50mm) |
Component size | ±01005（0.4mm * 0.2mm），0201 ,BGA and other high-precision ICs: we can detect BGA components with a Min 0.25mm pitch through X-ray |
| Board Thickness | 0.3mm ~4.5mmmm |
| The whole placement accuracy | 0.0375mm |
Printed Circuit Board Assembly Process
Some steps about PCB Assembly
Preparations before assembly
Check whether the raw materials such as electronic components are consistent with the BOM list provided by the customer to ensure that the raw materials meet the customer's requirements.
- DFA check
- Component incoming inspection
SMT & THT Assembly
The mounting of surface mount components and through-hole components.
- Solder Paste printing
- Pick & Place SMD Parts
- Reflow Soldering
- Flipping
- THT Components Placement
- Wave Soldering
- AOI/X-Ray Checking
- Visual Inspection
Inspection and Testing
We perform functional testing, X-ray and AOI inspection. Strictly control the quality of PCBA shipments
- ICT Testing
- Function Testing
- Final Inspection & Scanning
- Cleaning and Drying
- Packaging and Delivery
PCB Assembly Equipment
Automatic printing machine
- Model: G5
- Automatic printing machine
- Repeat positioning accuracy: ±0.01mm
- Printing accuracy: ±0.025mm
- Printing cycle: ≤8.5S
Solder Paste Tester
- Model: SINIC-TEK
- Minimum detection element: 01005 (imperial)
- Degree: XY direction 10um; height=0.37um
- Repeatability accuracy: height <1um; area/volume 1%
- Detection speed: 0.35 seconds/FOV
- Mark point recognition: 0.3 seconds/pcs
- Maximum detection height: ±450um (±1200um is optional)
SMT Placement Machine
- Model: FUJI Mounter NXT3
- Applicable substrate size: 48*48MM-534*610MM
- SMD range: 0201
- Mounting accuracy: 0.038mm, cpk≥1.00
- Mounting speed: 26000cph
SMT Placement Machine
- Model: FUJI AIMEX IIIC
- Applicable substrate size: 48×48mm-774×710mm
- SMD range: 0402
- Mounting accuracy: ±0.025mm Cpk≧1.00
- Mounting speed: 74000cph
Reflow Soldering Machine
- Model:Folungwin FL-VP1260
- Heating length: 2652mm
- Temperature range: room temperature - 350°C
- Number of heating zones: 8 temperature zones and 16 heating zones
- Number of cooling zones: 2 cooling temperature zones
SMT Intelligent First Article Detector
- Model: FAI-600
- Test signal frequency: 20Hz~300kHz
- Test accuracy: 0.05%
- Scanning element: CCD
- Scanning light source: LED
- Scanning range: 310mm*410mm
- Optical resolution: 600-2400dpi 0.01mm/pixel
PCB Assembly Equipment
Solder Paste Inspection (SPI)
Improper solder paste printing results in low product reliability and reduced performance.
Check function:
Reduces defects caused by improper solder paste printing, allowing immediate rework for high-quality solder paste printing. More time will be saved and manufacturing efficiency will be improved, early defects will be avoided to be delayed to the later stage of manufacturing, and costs will be reduced.
Automated Optical Inspection(AOI)
We use AOI instead of manual visual inspection to realize online automatic inspection.
Check function:
Missing parts, deviation, short circuit, reverse, side standing, tombstone, reverse white, multiple parts, poor solder joints (less tin, empty solder, no tin, more tin, thin tin and other poor processes)
X-Ray Inspection
The coverage rate of x-ray inspection technology to process defects is as high as 97%, with layering function.
Check Function:
Defects that can be inspected include: virtual soldering, bridging, standing, insufficient solder, air holes, missing components, etc. In particular, X-ray can also inspect hidden solder joints such as BGA and CSP.
First Article Detector
To ensure the SMT mass production quality, we will carry out the first article inspection, which can effectively and quickly judge the first board, find out the first board errors, omissions, over-posting, and under-posting materials in time, and take corrective or improvement measures to prevent batch failure.
Function Test(FCT)
The simulated operating environment makes the circuit board work in the design state, so as to obtain the output, and perform a test method to verify the functional state of the circuit board. The normal operation of the equipment indicates that the circuit board is qualifie
Testing Reports
If the customers need to COC, we supply the following reports free of charge:
Download: SampleCOCof Beton Technology
- Cross Section Reports
- First article inspection report
- Impedance Measurement Report
- MICROSECTION REPORT
- SOLDERABILITY TEST REPORT
- E-T TEST REPORT
- AOI report or visual inspection report
- Flying probe or in-circuit testing report
- Function testing report
FAQ
PCB files(Gerber file), bom list, XY
data(Pick-N-Place).
Yes, we will test each piece of PCBA
product under your testing methods, to ensure quality and functionality.
SPI, AOI, X-RAY, FQC for PCB assembly.
Automotive, Medical, Industrial Control,
IoT, Smart Home, Military, Aerospace.
Talk to a PCB Manufacturer Expert today
We look forward to working with you side by side, to be a long-term partner whom you can trust.